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Name of Invention Country Tech Sector Faculties or Schools Patent Number Patent Status Filing Date Inventor
一種使用導電黏合劑黏接電氣設備的方法及系統 China E&M 1 Manufacturing Tech Department of Electrical and Electronic Engineering 201010262578.6 Grant 2010/08/24 OR, Siu-wing Derek ;
使用導電膠黏合電氣裝置的方法與系統 Taiwan E&M 1 Manufacturing Tech Department of Electrical and Electronic Engineering 099128156 Grant 2010/08/24 OR, Siu-wing Derek ;
Method and system for bonding electrical devices using an electrically conductive adhesive United States Of America E&M 1 Manufacturing Tech Department of Electrical and Electronic Engineering 13/340,168 Grant 2011/12/29 OR, Siu-wing Derek ;
A method and system for bonding electrical devices using an electrically conductive adhesive United States Of America E&M 1 Manufacturing Tech Department of Electrical and Electronic Engineering 12/546,207 Grant 2009/08/24 OR, Siu-wing Derek ;
A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis Australia Health Care / Health Tech Department of Biomedical Engineering 2010278526 Grant 2010/07/20 ZHENG, Yongping ; CHEUNG, Chung Wai James ;
A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis Belgium Health Care / Health Tech Department of Biomedical Engineering Grant 1970/01/01 ZHENG, Yongping ; CHEUNG, Chung Wai James ;
A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis Canada Health Care / Health Tech Department of Biomedical Engineering 2,769,150 Grant 2010/07/20 ZHENG, Yongping ; CHEUNG, Chung Wai James ;
用於評估脊柱側凸的三維(3D)超聲成像系統 China Health Care / Health Tech Department of Biomedical Engineering 201080040696.0 Grant 2010/07/20 ZHENG, Yongping ; CHEUNG, Chung Wai James ;
A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis Czech Republic Health Care / Health Tech Department of Biomedical Engineering Grant 1970/01/01 ZHENG, Yongping ; CHEUNG, Chung Wai James ;
A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis Germany Health Care / Health Tech Department of Biomedical Engineering Grant 1970/01/01 ZHENG, Yongping ; CHEUNG, Chung Wai James ;
A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis European Procedure (Patents) Health Care / Health Tech Department of Biomedical Engineering 10803888.6 Grant 2010/07/20 ZHENG, Yongping ; CHEUNG, Chung Wai James ;
A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis Spain Health Care / Health Tech Department of Biomedical Engineering Grant 1970/01/01 ZHENG, Yongping ; CHEUNG, Chung Wai James ;
A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis France Health Care / Health Tech Department of Biomedical Engineering Grant 1970/01/01 ZHENG, Yongping ; CHEUNG, Chung Wai James ;
A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis United Kingdom Health Care / Health Tech Department of Biomedical Engineering Grant 1970/01/01 ZHENG, Yongping ; CHEUNG, Chung Wai James ;
A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis Croatia Health Care / Health Tech Department of Biomedical Engineering Grant 1970/01/01 ZHENG, Yongping ; CHEUNG, Chung Wai James ;
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